Significant step towards engineering contact modules with vertical carbon nanotube interconnects

Imec researchers, in collaboration with Tokyo Electron, have successfully integrated and characterized carbon nanotubes (CNT) into 150nm contact holes with a TiN underlayer and a Cu single damascene top contact module. The process steps are CMOS-compatible and the platform is designed for fast and automatic electrical testing and for benchmarking different CNT recipes and process conditions.

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