Henkel’s Conductive Die Attach Films Enable Leadframe Package Scalability at STMicroelectronics

Henkel today announced that it has worked with STMicroelectronics, one of the world's largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Henkel's Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions.

Related Posts

Comments are closed.