Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications

Novellus Systems has announced that it has developed conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology addresses sub-32nm requirements for front-end-of-line (FEOL) applications such as gate liners and spacers, shallow trench isolation high-k metal gate (HKMG) liners, and spacers used for double patterning applications.

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