Toxicity of silver nanoparticles increases during storage

Silver had already been recognized in ancient Greece and Rome for its infection-fighting properties but in modern times pharmaceutical companies made more money developing antibiotics. However, thanks to emerging nanotechnology applications, silver has made a comeback in the form of antimicrobial nanoparticle coatings for textiles, surgical instruments, lab equipment, floors or wall paints. The flip side of silver's desired toxicity towards microbes is that it might have toxic effects for humans as well and this has raised debate about the safety of nanosilver products. Although scientists have worked to reduce the toxicity of antimicrobial nanosilver in products, concerns remain. Not helping to put these concerns to rest is a new report from a group of researchers in Germany that shows that toxicity of silver nanoparticles increases during storage because of slow dissolution under release of silver ions.

Novel class of radially-aligned nanofibers promising for tissue regeneration

Nanotechnology-enabled tissue engineering is a rapidly growing field. At the core of tissue engineering is the construction of scaffolds out of biomaterials to provide mechanical support and guide cell growth into new tissues or organs. In particular, electrospun biodegradable polymeric nanofibers are being used in scaffolds for engineering various tissues such as nerves, cartilages or bone. Electrospinning is a fabrication technique which can produce nanoscale fibers from more than 100 different polymers. The electrospun nanofibers are typically collected as nonwoven mats with random orientation. A new study has now demonstrated the fabrication of a novel class of nanofiber scaffold composed of radially-aligned, electrospun nanofibers and also demonstrated the unique application of these materials as effective biomedical patches/scaffolds that could prove to be beneficial during neurosurgery.

Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications

Novellus Systems has announced that it has developed conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology addresses sub-32nm requirements for front-end-of-line (FEOL) applications such as gate liners and spacers, shallow trench isolation high-k metal gate (HKMG) liners, and spacers used for double patterning applications.

Major hurdle cleared for organic solar cells

Researchers demonstrate enhanced performance of a hybrid photovoltaic device, where poly[3-hexylthiophene] (P3HT) is used as active material and a solution-processed thin flat film of ZnO modified by a self-assembled monolayer (SAM) of phenyl-C61-butyric acid (PCBA) is used as electron extracting electrode.