For the first time, atomic force microscopy helps scientists reveal the exact chemical structure of a natural compound

In a pioneering research project, for the first time, scientists at IBM and the University of Aberdeen have collaborated to 'see' the structure of a marine compound from the deepest place on the Earth using an atomic force microscope (AFM). The results of the project open up new possibilities in biological research which could lead to the faster development of new medicines in the future.

Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages

Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).