Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R+D program focuses on the development of GaN-on-Si (gallium nitride-on-silicon) process and equipment technologies for manufacturing solid state lighting (e.g. LEDs) and next-generation power electronics components on 8-inch Si wafers.

HZB researchers observe atomic processes while doping semicon-ductor materials.

Imec realized large-area (70cm2) epitaxial solar cells with efficiencies of up to 16.3% on high-quality substrates. And efficiencies of up to 14.7% were achieved on large-area low-quality substrates, showing the potential of thin-film epitaxial solar cells for industrial manufacturing.

Market leaders in temperature controlled microscopy, Linkam Scientific Instruments, teams up to supply stages to LC-Vision, suppliers of state-of-the-art turnkey systems for high throughput automated liquid crystal analysis.

Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.

NanoSight, world-leading manufacturers of unique nanoparticle characterization technology, together with distributor partners Schaefer Technologie, have recently held a meeting of users of their successful range of nanoparticle tracking analysis instruments in Langen, Germany.

Imec today reports promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield.

Bayer MaterialScience AG and Holst Centre, an open-innovation initiative by research organizations IMEC (Belgium) and TNO (The Netherlands), have now announced their partnership in the field of flexible electronics. By joining the Holst Centre eco-system, Bayer exchanges its own expertise with the existing network of academic and industrial partners.

Imec and ASML collaborated to qualify ASML's Tachyon Source Mask Optimization and programmable illuminator system FlexRay, proving its potential with the demonstration of a 22nm SRAM memory cell.

AIXTRON AG today announced an order for its QXP-8300 ALD deposition tool from a major Taiwanese foundry. The order is for a 300MM system for the deposition of next generation high-k materials by Atomic Layer Deposition (ALD).

Crossing Automation, Inc., a leading supplier of efficient, cost-effective front-end and back-end automation solutions and engineering services to high volume semiconductor equipment manufacturers, today announced that it has received an order for its ExpressConnect integrated automation platform.

Franco Cerrina, 62, chair of the College of Engineering's electrical and computer engineering department, was found dead Monday morning in a laboratory on the fifth floor of the Photonics Center.

Today, HamaTech APE GmbH introduced the latest addition to its Next Generation Lithography line of mask integrity platforms, the MaskTrack Pro Bake/Develop (BD). The product addresses the challenges of mask manufacturing of advanced 193i Optical Immersion and Extreme Ultraviolet Lithography (EUVL).

JA Solar signed a three-year supply agreement for silicon nanoparticle ink from Innovalight for the production of JA Solar's recently announced SECIUM high efficiency solar cells.

The new report 'Can Nanotech Unlock the Fountain of Youth?', finds that the beauty industry has begun to make an aggressive foray into nanotechnology, using tiny molecular compounds to improve the performance of creams, sunscreens, shampoos and other personal-care products.

ASML Holding NV today at SEMICON West announces broad customer adoption of holistic lithography products which optimize semiconductor scanner performance and provide a faster start to chip production.

New initiative dedicated to enabling reliable, affordable, energy-efficient systems.

Awareness campaign emphasizes global opportunities for the European semiconductor industry.

Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions at the Semicon West 2010, Intersolar North America and ASMC (Advanced Semiconductor Manufacturing Conference) events in San Francisco this week.

Applied Materials, Inc. today announced that it has signed a comprehensive, five-year contract to service all Applied Materials chip production equipment at NXP Semiconductor's facility in Nijmegen, Holland.