Hydrogen causes metal to break

Hydrogen is considered the fuel of the future. Yet this lightest of the chemical elements can embrittle the metals used in vehicle engineering. The result: components suddenly malfunction and break. A new special laboratory is aiding researchers' search for hydrogen-compatible metals.

Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages

Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).