Akron team leverages supercomputers to better understand tie molecules.

Some 30 activists representing 14 environmental, technology assessment and consumer organisations from Europe, the United States, Canada and Latin America met for the 4th International Nanotechnology Activist Summit in Berlin on October 6 and 7.

Scientists are investigating a possible link between tiny particles of pollution found in diesel fumes and the global collapse of honey bee colonies.

A new kind of screen pixel doubles as a solar cell and could boost the energy efficiency of cell phones and e-readers. The technology could also potentially be used in larger displays to make energy-harvesting billboards or decorative solar panels.

The International Organization for Standardization (ISO) has released ISO/TS 80004-7:2011 which is applicable to the use of nanotechnologies in medical diagnostics and therapeutics.

Researchers have used sulfur-coated hollow carbon nanofibers and an electrolyte additive to fabricate a superior rechargeable lithium battery cathode. According to Cui, putting silicon nanowire anodes and sulfur-coated carbon cathodes into one battery could be the next generation in battery design.

Dow and Argonne will be collaborating on several new materials with the intent to improve the performance, cost competitiveness and adoption of these advanced materials in the energy storage industry.

Ion exchange leads to complex cell systems with inorganic membranes.

Future of nanotechnology to detect viruses and more outlined.

A new thesis by Ineke Malschat the Radboud University Nijmegen examines how ethically sound governance of nanotechnology may be possible in the current global world order.

Nanoinformatics 2011 will bring together informatics experts, nanotechnology researchers, and other stakeholders and potential contributors to advance Nanoinformatics 2020 Roadmap goals.

Thin film solar printing leader Nanosolar, Inc. today announced that the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) has certified an aperture efficiency of 17.1% for a solar cell fabricated using Nanosolar's non-vacuum, low cost printing on flexible foil technology.

Professor John Boland, Director of CRANN, the Science Foundation Ireland (SFI) funded nanoscience institute at Trinity College Dublin, has today been named the Laureate of the 2011 ACSIN Nanoscience Prize for his outstanding work in the development and application of scanning probe microscopy and spectroscopy and in the use of these tools to advance our understanding of chemical and physical phenomena of materials.

ARM and UMC, a leading global semiconductor foundry, today announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan Physical IP solutions validated on UMC's 28HPM process technology.

Proceeds from this financing will be used as to approximately $15,000,000 for the establishment of a full scale production facility for ultracapacitors and fundamental research center in the Russian Federation and as to approximately $5,000,000 for the expansion of Nesscap's current manufacturing and core R+D operations in Korea and for general corporate purposes.

This master program aims at giving an extensive two-year teaching program from fundamentals to advanced research topics in Photonics and its interdisciplinary applications.

At Fusion 2011, AMD today demonstrated its next generation graphics processor, based on the cutting-edge 28nm process technology.

eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), and MIPS Technologies, a leading provider of industry-standard processor architectures and cores, announced the tapeout of a high-performance, three-way microprocessor cluster on GLOBALFOUNDRIES' leading-edge, low-power 28nm-SLP process technology.

Scientists at The University of Nottingham are developing microscopic organic medical imaging systems to support a new generation of breakthrough treatments for currently incurable diseases and chronic life-threatening illnesses.

A single drop of water can be fatal to electrical circuits. To prevent water damage, current electronic devices are well sealed and packaged with polymer passivation. Researchers in Korea have now gone one step further and made water resistance a feature of the device itself by incorporating nonwetting, superhydrophobic components into the electronic device. They demonstrated this novel idea with a source/drain structure in a thin-film transistor. This work combines superhydorphobicity with electronic devices, especially resistive switching memory devices. Although much research has been done on either topic, few works report the combination of combining superhydrophobicity and electronic devices. This is a novel approach to combine two different concepts to get a synergic effects.