Recently, Intel, AMD, Samsung, LG Innotek, and SKCs US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Due to its excellent performance, glass substrate technology has become a rising star in the field of advanced packaging. <\/p>\n
In September 2023, Intel announced the so-called next-generation advanced packaging glass substrate technology, claiming it could revolutionize the entire chip packaging field. Glass substrate refers to the replacement of organic materials in organic packaging with glass, rather than replacing the entire substrate. Therefore, Intel will not mount chips on pure glass; instead, the core material of the substrate will be made of glass. <\/p>\n
Intel stated that glass substrates could lay the foundation for achieving an astounding one trillion transistors on a single package within the next decade. Based on its promising prospect, rumors surface recently that Intel plans to mass-produce glass substrates as early as 2026. Intel has invested approximately a decade in glass substrate technology and currently has a fully integrated glass research line in Arizona, USA. The company stated that the production line costs over USD 1 billion and requires collaboration with equipment and material partners to establish a complete ecosystem. Currently, only a few companies in the industry can afford such an investment, and Intel seems to be the only company so far to successfully develop glass substrate. <\/p>\n
Apart from Intel, SKCs US subsidiary Absolics, AMD, and Samsung also see the broad development prospect of glass substrate. <\/p>\n
In 2022, SKCs US subsidiary Absolics invested around KRW 300 billion to establish the first factory dedicated to producing glass substrate in Covington, Georgia, USA. Recently, the company announced that the factory has been completed and has begun mass production of prototype products. Industry analysts believe this marks a critical moment for the global glass substrate market. <\/p>\n
Samsung has formed an alliance composed of Samsung Electro-Mechanics, Samsung Electronics, and Samsung Display to develop glass substrate, aiming to start large-scale mass production in 2026 and commercialize the technology faster than Intel. Its reported that Samsung Electro-Mechanics plans to install all necessary equipment on a pilot production line by September this year and commence operations in the fourth quarter. <\/p>\n
AMD plans to launch glass substrate between 2025 and 2026 and to collaborate with global component companies to maintain its leading position. According to Korean media reports, AMD is conducting performance evaluation tests on glass substrate samples from several major global semiconductor substrate companies, intending to introduce this advanced substrate technology into semiconductor manufacturing. <\/p>\n
Currently, with the emergence of new companies like SCHMID and the participation of laser equipment suppliers, display manufacturers, and chemical suppliers, the industry is gradually forming some new supply chains around glass core substrate, and create a diversified ecosystem. <\/p>\n
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(Photo credit: Intel) <\/p>\n
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[News] Glass Substrate Mass Production is Nearing, with Tech Giants Leading the Way - TrendForce<\/a><\/p>\n","protected":false},"excerpt":{"rendered":" Recently, Intel, AMD, Samsung, LG Innotek, and SKCs US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Due to its excellent performance, glass substrate technology has become a rising star in the field of advanced packaging Continue reading