5 hours ago Dec. 20, 2013 - 8:55 AM PST<\/p>\n
Several years ago, manufacturers set out to rid electronics of hazardous materials by removing lead from solder. Unfortunately, the tin-based, lead-free solder became prone to a detrimental phenomenon known as tin whiskers, microscopic metal growths on soldering points of a circuit board that often lead to short circuits. <\/p>\n
Using his research at Lockheed Martins Advanced Technology Center in Palo Alto, Calif., where nanotechnology development effortswere under way, Dr. Alfred Zinn was able to help find a tin whiskers solution. <\/p>\n
It is amazing that we can now employ nanotechnology and break fundamental boundaries that we previously thought to be physical constants, said Dr. Zinn. <\/p>\n
During his research, he found that using CuantumFuse, a printable nanocopper paste, could help achieve the desired processing temperature for electronic assembly. <\/p>\n
Since solder is a low-cost commodity item and can only be replaced by a competitive product,Lockheed Martin created a synthesis process that allows for fast and affordable production of CuantumFuse. Replacing tin-based solder with pure copper solder offers several benefits: much greater thermal and electrical conductivity, the elimination of the danger from whiskers and improved product performance by an order of magnitude once fully developed. <\/p>\n
CuantumFuse is a true revolution that offers high reliability and a lead-free solution for a wide variety of commercial and government applications, said Dr. Ken Washington, the VP of Advanced Technology Center. This innovative use of nanotechnology opens a breadth of opportunities in the automobile and medical industries, electronic cooling and others. <\/p>\n<\/p>\n
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