{"id":60550,"date":"2012-11-28T10:42:05","date_gmt":"2012-11-28T10:42:05","guid":{"rendered":"http:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/uncategorized\/on-semiconductors-advanced-cmos-process-expertise-enables-groundbreaking-image-sensor-for-astronomy.php"},"modified":"2012-11-28T10:42:05","modified_gmt":"2012-11-28T10:42:05","slug":"on-semiconductors-advanced-cmos-process-expertise-enables-groundbreaking-image-sensor-for-astronomy","status":"publish","type":"post","link":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/astronomy\/on-semiconductors-advanced-cmos-process-expertise-enables-groundbreaking-image-sensor-for-astronomy.php","title":{"rendered":"ON Semiconductor\u2019s Advanced CMOS Process Expertise Enables Groundbreaking Image Sensor for Astronomy"},"content":{"rendered":"<p><p>    PHOENIX--(BUSINESS WIRE)--  <\/p>\n<p>    ON Semiconductor (Nasdaq:     ONNN), driving innovation in energy efficiency, has    collaborated with Teledyne Imaging Sensors to manufacture an    Extremely Large Stitched Read Out Integrated Circuit (ELS ROIC)    for astronomy. The H4RG-15 image sensor, designed by Teledyne,    is the latest generation of a 20-year effort sponsored by the    National Science Foundation, the National Aeronautics and Space    Administration, and Teledyne internal funding to develop    increasingly larger and more powerful infrared sensors for    astronomical research.  <\/p>\n<p>    The 16 megapixel H4RG-15, which consists of Teledynes HgCdTe    detector material hybridized to a CMOS readout circuit, is the    largest sensor ever produced for infrared astronomy. An    enabling technology in the development of the H4RG-15 is the    ability to fabricate and reliably yield the 63 mm x 63 mm    stitched CMOS ROIC using ON Semiconductors proprietary        180 nanometer process technology. The ROIC is so large that    only four die fit onto a 200 mm wafer.  <\/p>\n<p>    The high yield for these ELS ROICs can be attributed to the    expertise and yield improvement efforts made by ON    Semiconductors wafer fabrication team in collaboration with    its     Custom Foundry Division. The H4RG-15 readouts were    manufactured at ON Semiconductors wafer manufacturing facility    located in Gresham, Oregon. With this project, ON Semiconductor    has demonstrated that it can successfully produce the H4RG-15    with the yield required for this next generation sensor.  <\/p>\n<p>    The H4RG-15 sensor has been installed at the University of    Hawaiis observatory on Mauna Kea to confirm the performance of    the sensor under telescope observing conditions. The    resolution with which images can be captured using this new    sensor system represents a major step forward in the    progression of IR astronomy, said Dr. Donald Hall of the    Institute for Astronomy at the University of Hawaii, who is the    principal investigator for the NSF-funded H4RG-15 development    program.  <\/p>\n<p>    The H4RG-15 is the next step in the highly successful HxRG    family of image sensors that Teledyne has developed and    delivered to the leading astronomical observatories, on ground    and in space, including the Hubble Space Telescope, the James    Webb Space Telescope, and every major ground-based observatory.  <\/p>\n<p>    The H4RG-15 is critical to the next generation of ground-based    telescopes. The 30-meter class Extremely Large Telescopes    (ELTs) and future space missions will be designed around the    H4RG-15, stated Richard Blank, Teledynes senior program    manager for the H4RG-15. We greatly value our partnership with    ON Semiconductor, which has been critical to the successful    development of the H4RG-15, added James Beletic, Vice    President of Space & Astronomy at Teledyne Imaging Sensors.  <\/p>\n<p>    The success of the H4RG-15 ROIC is an important validation of    the capabilities of our companys foundry services in addition    to our process capabilities in CMOS imaging, adds Rocke Acree,    Business Unit Manager, Custom Foundry Division at ON    Semiconductor. The H4RG-15 ROIC produced for Teledyne Imaging    Sensors is one of the largest CMOS chips ever made. The    innovative stitching process ON Semiconductor utilized for the    project enables the production of sensors with far greater    physical size to be developed from smaller building blocks. It    demonstrates both the versatility and the depth of the    technical capabilities we can offer to the market, for even the    most demanding of application requirements.  <\/p>\n<p>    For more information about ON Semiconductors foundry services    visit     <a href=\"http:\/\/www.onsemi.com\/customfoundry\" rel=\"nofollow\">http:\/\/www.onsemi.com\/customfoundry<\/a>  <\/p>\n<p>    About ON Semiconductor  <\/p>\n<\/p>\n<p>Read more: <\/p>\n<p><a target=\"_blank\" href=\"http:\/\/finance.yahoo.com\/news\/semiconductor-advanced-cmos-process-expertise-210000713.html;_ylt=A2KJjahs6rVQ.mAAyn__wgt.\" title=\"ON Semiconductor\u2019s Advanced CMOS Process Expertise Enables Groundbreaking Image Sensor for Astronomy\">ON Semiconductor\u2019s Advanced CMOS Process Expertise Enables Groundbreaking Image Sensor for Astronomy<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p> PHOENIX--(BUSINESS WIRE)-- ON Semiconductor (Nasdaq: ONNN), driving innovation in energy efficiency, has collaborated with Teledyne Imaging Sensors to manufacture an Extremely Large Stitched Read Out Integrated Circuit (ELS ROIC) for astronomy. The H4RG-15 image sensor, designed by Teledyne, is the latest generation of a 20-year effort sponsored by the National Science Foundation, the National Aeronautics and Space Administration, and Teledyne internal funding to develop increasingly larger and more powerful infrared sensors for astronomical research <a href=\"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/astronomy\/on-semiconductors-advanced-cmos-process-expertise-enables-groundbreaking-image-sensor-for-astronomy.php\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"limit_modified_date":"","last_modified_date":"","_lmt_disableupdate":"","_lmt_disable":"","footnotes":""},"categories":[21],"tags":[],"class_list":["post-60550","post","type-post","status-publish","format-standard","hentry","category-astronomy"],"modified_by":null,"_links":{"self":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts\/60550"}],"collection":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/comments?post=60550"}],"version-history":[{"count":0,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts\/60550\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/media?parent=60550"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/categories?post=60550"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/tags?post=60550"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}