{"id":26918,"date":"2010-08-03T08:08:58","date_gmt":"2010-08-03T08:08:58","guid":{"rendered":"http:\/\/euvolution.com\/futurist-transhuman-news-blog\/henkel-launches-wafer-backside-coating-technology-for-stacked-die-packages\/"},"modified":"2010-08-03T08:08:58","modified_gmt":"2010-08-03T08:08:58","slug":"henkel-launches-wafer-backside-coating-technology-for-stacked-die-packages","status":"publish","type":"post","link":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/nanotechnology\/henkel-launches-wafer-backside-coating-technology-for-stacked-die-packages.php","title":{"rendered":"Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages"},"content":{"rendered":"<p>Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address &hellip; <a href=\"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/nanotechnology\/henkel-launches-wafer-backside-coating-technology-for-stacked-die-packages.php\">Continue reading <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"limit_modified_date":"","last_modified_date":"","_lmt_disableupdate":"","_lmt_disable":"","footnotes":""},"categories":[7],"tags":[],"class_list":["post-26918","post","type-post","status-publish","format-standard","hentry","category-nanotechnology"],"modified_by":null,"_links":{"self":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts\/26918"}],"collection":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/comments?post=26918"}],"version-history":[{"count":0,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/posts\/26918\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/media?parent=26918"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/categories?post=26918"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.euvolution.com\/futurist-transhuman-news-blog\/wp-json\/wp\/v2\/tags?post=26918"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}