Overview <\/p>\n
This instrument has been integrated using the 3D PLUS technology in order to be as compact as possible. It includes includes 4 stacked levels in a 3D cube with a reduced volume of 35x35x23 mm3. The top level contains the 2048x2048 pixels color CMOS image sensor which is the key element of the camera. Images are provided by the CMOS sensor through the 10 LVDS multiplexable output pairs that can be configured as 20 single-ended outputs increasing the number of single-ended outputs up to 33 signals. <\/p>\n
An FPGA is integrated in themodule andcan store images in the volatile memory placedat the same level and perform preliminary image processing as averaging, adding, windowing etc <\/p>\n
The 3DCM681 space camerais suitable to cover a wide range of scientific applications such as planetology, but also platforms or launchers monitoring and star trackers. <\/p>\n
2048 (H) * 2048 (V) active pixels on 5.5m pitch <\/p>\n
User-configurable FPGA <\/p>\n
Frame rate: <\/p>\n
12 frames\/s @ full resolution (12-bit mode) <\/p>\n
16 frames\/s @ full resolution (10-bit mode) <\/p>\n
Embedded 2x512Mb SDRAM and 8Gb NAND Flash <\/p>\n
Integrated clock and Timing generator <\/p>\n
Integrated Image Signal Processor <\/p>\n
Programmable gain amplifier and offset regulation <\/p>\n
13 general purpose signals <\/p>\n
10 LVDS output pairs and 2 LVDS input pairs <\/p>\n
Radiation Hardened design <\/p>\n
TID > 40Krad(Si) <\/p>\n
SEL LET > 60MeV.cm\/mg <\/p>\n
Space Qualified Technology <\/p>\n
Worldwide delivery guarantee <\/p>\n<\/p>\n
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Original post: <\/p>\n
4 Mpx CMOS Camera - 3D PLUS<\/a><\/p>\n","protected":false},"excerpt":{"rendered":" Overview This instrument has been integrated using the 3D PLUS technology in order to be as compact as possible. It includes includes 4 stacked levels in a 3D cube with a reduced volume of 35x35x23 mm3 Continue reading