Micro and Nano-interconnects with shielding reduce EMI in tight spaces. <\/p>\n
MINNEAPOLIS, Circuits are being squeezed into smaller spaces and being used at higher speeds, with mixed signals and occasionally including digital burst transmissions. By condensing more electronics into the smaller areas the designer is faced with additional challenges. Micro and nano-connectors use smaller diameter cables and allow signal routing adjacent to potentially noisy electronic processing equipment. The cable themselves can create and carry inductively coupled noise that could interfere with other circuitry. This can cause potential problems for either the signal being carried in the cable and or the processing elements on a printed circuit board that they pass by. Poorly matched impedance circuits and cables can cause a noise factor that reduces signal integrity of any number of elements in the system.There are numerous noise management and control methods available in electronic design, but as space and weight become a key factor, only a few efficient methods remain.To solve many of these issues, a range of cable shielding and grounding techniques are employed. As miniature cabling continues to rapidly evolve in assisting higher speed differential signal processing, solutions are critical. Cables adding drain wiring in addition to shielding significantly improve the noise to signal ratio as well. Additional micro and nano cable shielding information is available at http:\/\/www.omnetics.com<\/a>. <\/p>\n In addition to cable design, nano-miniature and micro-miniature connectors are used to help squeeze into tightly designed spaces. Micro and nano connectors are low profile, lighter weight and offer good connections for most routing signals in small electronics and modules. Micro and nano cabling to the connectors can be specifically designed to protect both cable and circuits and be more flexible to assist in routing. The new slim-lined .025\" pitch connectors with integrated back-shells save weight and space while achieving up to 85 db of EMI isolation in noisy, high speed environments. More and more, we see systems evolve with one part of the circuit being larger and use Micro-D size connectors at .050\" pitch. The other end of the cable has little space available and may have multiple break-out modules that need nano-sized connections. Custom Micro to Nano-cables are readily configured including metal mesh for noise shielding that is terminated on each connector using a 360 degree seal that insures high noise protection. Polymer jackets can be added to the exterior of the shielded cable to provide softer and smoother feel and protection of the cable. A wide range of both circular and rectangular micro and nano-connector formats are available to select for specific applications. Alternative shielding materials from braided metal systems to simple slip-on shielding materials can help match the design to the need. When requested, Omnetics offers design engineers a direct interface with the connector engineering team at Omnetics. By using Solid Works online, a new design can be generated in a couple of days. Customized standards come quick and easy with minimal adjustments to our connector cases and shielding systems. Micro and Nano connectors are well established in the high-reliability industries of Military- Aerospace, robotics, surveillance and medical electronics industry. Design assistance and specifications are available to the design engineer, as well as Quality documents as proof of quality and reliability. To see more details please see our web site at: http:\/\/www.omnetics.com<\/a> <\/p>\n Technical Contact: dhunt@omnetics.com<\/a> <\/p>\n Media Contact: Bob Stanton Email ph. 623-521-6685 <\/p>\n <\/p>\n Excerpt from: <\/p>\n Omnetics Launches Line of Miniature Cables and Connectors to Improve High Density Circuit ...<\/a><\/p>\n","protected":false},"excerpt":{"rendered":" Micro and Nano-interconnects with shielding reduce EMI in tight spaces. MINNEAPOLIS, Circuits are being squeezed into smaller spaces and being used at higher speeds, with mixed signals and occasionally including digital burst transmissions. By condensing more electronics into the smaller areas the designer is faced with additional challenges. Continue reading