Presentations and tutorials focus on increasing system performance <\/p>\n
SAN JOSE, Calif. - Xilinx, Inc. (NASDAQ: XLNX) experts will highlight high-performance FPGA design techniques including 28Gbps backplane transceiver design, 3D stacked silicon package design, and comprehensive DDR4 signal-integrity analysis using high-performance UltraScale FPGA silicon and packaging at DesignCon 2014. Through a series of tutorials and paper presentations, Xilinx experts will share their insights for overcoming system-design challenges and increasing system performance. Learn more about Xilinx UltraScale multi-Gigabit transceivers, 3D stacked silicon, and advanced signal-integrity techniques at http:\/\/www.xilinx.com\/products\/technology\/index.htm<\/a> and by attending Xilinx presentations and tutorials at DesignCon 2014 January 28 - 31, 2014 at the Santa Clara Convention Center in Santa Clara, CA. <\/p>\n Xilinx Tutorials <\/p>\n Tuesday, January 28, 2014 at 9:00 am - 12:00 pm, Ballroom K <\/p>\n Hands-On Tutorial for Fixture Removal of 28Gbps Tx Measurements <\/p>\n - This tutorial will offer tips and advanced techniques for characterizing a 28Gbps transceiver. Leading experts will provide the opportunity for you to follow along with hands-on computer labs using the latest in software tools for measurement calibration and fixture characterization, simulated fixture channel verification and analysis, and synthesis with in-situ fixture de-embedding with measured data. <\/p>\n Tuesday, January 28, 2014 at 9:00 am - 12:00 pm, Ballroom E <\/p>\n High Density High Performance Package and 3D Interconnect Design <\/p>\n - This tutorial is targeted at design and technology enablement for high-density and high-performance heterogeneous multi-chip integration with 3D interconnects. Multi-chip integration is defined by a broad range of high density interconnect technologies including high density PoP type package, SiP, SoP, TSV, and interposer, and most distinguishingly, addressing interconnect density at silicon level. <\/p>\n Tuesday, January 28, 2014 at 1:30 pm - 4:30 pm, Ballroom G <\/p>\n <\/p>\n See the original post:<\/p>\n Xilinx Experts to Highlight High-Performance 7 Series and UltraScale FPGA Designs at DesignCon ...<\/a><\/p>\n","protected":false},"excerpt":{"rendered":" Presentations and tutorials focus on increasing system performance SAN JOSE, Calif. - Xilinx, Inc Continue reading